Aktive Filters Design Handbook by Moschytz Horn

By Moschytz Horn

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The expected behavior of passive, discrete components for both high and low frequencies is illustrated in Fig. 1. Component Low-Frequency Behavior High-Frequency Behavior Response Resonant wavelengths at high frequencies. Ju~\ \Vire / Resistor Capacitor Inductor f Transformer z I<:::: ----- ----- _____ f Response curves Solid line is low-frequency behavior. Dashed line is high-frequency behavior. 1 Component characteristic at RF frequencies. 2 • How and Why RF Energy Is Developed Within the PCB 15 Capacitance is always present between two leads.

After these two steps are completed, the rest of the design can be finalized. The following requirements are mandatory: I. Identify all power and ground sources, along with critical signal nets. 2. Partition the layout into functional subsections. Take into consideration requirements of sensitive components and their physical relationship to I/O ports and interconnects. 3. Position all components with critical signal nets adjacent to each other. 4. If different ground nodes are required, determine if they are to be connected together, and if so, where.

Low migration . First Configuration (rarely used) (Fig. 5 square in. 8 square cm). • Run power and circuit traces at 90-degree angles to each other, power on one layer, ground on the other. • Place ground traces on one layer-vertical polarization; place power traces on the other layer-horizontal polarization, or vice versa. • Locate decoupling capacitors between the power and ground traces at all connectors and at each Ie. For Fig. 9, a return trace must be placed as physically close to the high-threat signal trace as possible to permit RF energy to complete its return path back to the source.

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