By Tapan K. Gupta
This can be the 1st instruction manual at the fabrication and layout of hybrid microelectronic circuits.
* offers with all points of the know-how, layout, structure and processing of materials.
* Fills the necessity for a accomplished survey of a widely-used expertise.
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Extra resources for Handbook of Thick- and Thin-Film Hybrid Microelectronics
Loan, and C. N. Kwee, A multichip printed circuit board hybrid for the HP 18C and 28C handheld calculators, Proc. Int. Symp. , Minneapolis, MN, 1987, p. 268. 110. P. , The Technology of Printed Circuits, Academic Press, San Diego, CA, 1959. 111. T. H. , Flexible Printed Circuits, McGraw-Hill, New York, 1996. 112. R. , Wireless Communication Design Handbook, Academic Press, San Diego, CA, 1998. 113. L. Harte, R. Kikta, and R. , 3G Wireless Demystiﬁed, McGraw-Hill, New York, 2001, p. 210. 114. U.
Where k is the Boltzmann constant, T the temperature in absolute degrees kelvin, e ¼ Àq ¼ charge on electrons, A is the Richardson constant, and j the potential barrier. To understand the essence of the science and to correlate the mechanism of the termination e¤ect , a theoretical model is presented here. 6 shows the schematic diagram and equivalent-circuit parameters of a deposited resistor ﬁlm. Let us assume that the interfacial material has a uniform layer of resistive material characterized by its speciﬁc conductance G (S/sq).
Vol. 17, No. 3, 1994, p. 302. 64. J. F. , Digital Principles and Practices, Prentice Hall, Upper Saddle River, NJ, 1990. REFERENCES 33 65. J. H. , Flip Chip Technologies, McGraw-Hill, New York, 1996, p. 317. 66. G. E. Hartland, High-voltage application for automotive applications, Int. Symp. , Dallas, TX, 1969, pp. 361–368. 67. M. J. , Lasers and Their Applications, Taylor & Francis, London, 1976, Chap. 11. 68. R. J. , Electrochemical Society, Pennington, NJ, 1989. 69. M. , Fundamentals of Microfabrication, CRC Press, Boca Raton, FL, 1997.