Interconnect-Centric Design for Advanced SOC and NOC by Jari Nurmi, H. Tenhunen, J. Isoaho, Axel Jantsch

By Jari Nurmi, H. Tenhunen, J. Isoaho, Axel Jantsch

In Interconnect-centric layout for complex SoC and NoC, we've got attempted to create a accomplished figuring out approximately on-chip interconnect features, layout methodologies, layered perspectives on diverse abstraction degrees and eventually approximately employing the interconnect-centric layout in system-on-chip layout.
Traditionally, on-chip communique layout has been performed utilizing relatively ad-hoc and casual techniques that fail to fulfill a few of the demanding situations posed through next-generation SOC designs, akin to functionality and throughput, energy and effort, reliability, predictability, synchronization, and administration of concurrency. to deal with those demanding situations, it truly is serious to take a world view of the conversation challenge, and decompose it alongside traces that make it extra tractable. We think layered procedure just like that outlined via the communique networks group also needs to be used for on-chip communique layout.
The layout matters are dealt with on actual and circuit layer, common sense and structure layer, and from method layout technique and instruments standpoint. Formal verbal exchange modeling and refinement is used to bridge the communique layers, and network-centric modeling of multiprocessor on-chip networks and socket-based layout will serve the advance of systems for SoC and NoC integration. Interconnect-centric layout for complex SoC and NoC is concluded by way of software examples: interconnect and reminiscence association in SoCs for complex set-top packing containers and television, and a case learn in NoC platform layout for extra known purposes.

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5/6, pp. 621-650, Sept/Nov, 1999. [20] G. A. 1, pp20-36, 1995 [21] Semiconductor Industry Association, The National Technology Roadmap for Semiconductors, San Jose, CA, 1997. [22] R. Ho, K. W. Mai, and M. K. 490-504. [23] B. Curran, P. 238-240, Technical Digest, San Francisco, Feb. 2001. [24] M. T. Bohr, “Interconnect scaling – the real limiter to high performance ULSI,” IEEE Int. Electron Device Meeting, Tech. -R. Zheng, and H. Tenhunen, “Noise margin constraints on interconnectivity for low power and mixed-signal VLSI circuits,” in Advanced Research in VLSI: Proc.

Similarly, an LC line means the resistance in this line is negligible. It was found that if the wire length and wire impedance are chosen such that Rwl < Zo with Zo the wire characteristic impedance, the LC delay will dominate the total interconnect delay; otherwise the line delay is dominated by a slow RC response [16] [17]. 7. In practice, overshoots and oscillatory output voltages are usually damped by sizing the driver impedance and utilization of a diode clamp [18][19]. 6) where ttof is the time-of-flight delay representing the time required for a signal traveling from one place to another at the wave velocity, l is the wire length, v is the signal velocity, Lw and Cw represent respectively the per unit length inductance and the per unit length capacitance of the interconnect.

Tenhunen, “Fast modeling of core switching noise on distributed RLC power grid in ULSI circuits,” IEEE Transactions on Advanced Packaging, , vol. 245-254. g. com/. g. S. Rosenstark, “Transmission Lines in Computer Engineering”, McGraw-Hill, New York, 1994. [7] W. J. Dally, and J. W. Poulton, Digital System Engineering, Cambridge University Press, 1998, ISBN 0-521-59292-5. [8] M. I. Montrose, Printed Circuit Board Design Techniques for EMC Compliance, IEEE Press, 1996, ISBN 0-7803-1131-0. [9] C.

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